Micromachines, Free Full-Text
Adhesion-Delamination Phenomena at The Surfaces and Interfaces in Microelectronics and MEMS Structures and Packaged Devices, PDF, Adhesion
US8951840B2 - FCOC (Flip Chip On Chip) package and manufacturing method thereof - Google Patents
Solutions for 3D Integration and Advanced Packaging
Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
Frontiers All-Polymer Printed Low-Cost Regenerative Nerve Cuff Electrodes
Transparent neural interfaces: challenges and solutions of microengineered multimodal implants designed to measure intact neuronal populations using high-resolution electrophysiology and microscopy simultaneously
Defect Site - an overview
Review of THz-based semiconductor assurance
Packaging commercial CMOS chips for lab on a chip integration - Lab on a Chip (RSC Publishing) DOI:10.1039/C4LC00135D
Figure 4 from Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package
Figure 1 from Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package
PDF) Experiments and Three-Dimensional Modeling of Delamination in an Encapsulated Microelectronic Package Under Thermal Loading
