Segregation of silver at the interfaces. SEM images of: (a) as
Cu/Ni interface study for bump reliability improvement
Electromigration Mechanism of Failure in Flip-Chip Solder Joints
Coatings, Free Full-Text
Schematics of bump metallization for three TVs.
Six cases of reliability study of Pb-free solder joints in
Effect of Under Bump Metallization (UBM) Quality on Long Term
A study in flip-chip UBM/bump reliability with effects of SnPb
Materials, Free Full-Text
Simulation of current distribution in the solder bump: ͑ a ͒ Solder
Sensors, Free Full-Text
Stacked solder bumping technology for improved solder joint
Materials, Free Full-Text
A study in flip-chip UBM/bump reliability with effects of SnPb
Effect of Under Bump Metallization (UBM) Quality on Long Term
