The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.
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Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
Figure 2 from Study on flip chip assembly of high density micro
The optical images of the flip chip specimens.
Flip Chips-Pac Tech Dummy Components
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Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10, FA1O , FA 10 , FA-10, PB6, PB-6, PB06, PBO6 , PB-06, PB8, PB-8, PB08, PBO8 , PB-08, PB4, PB-4
Process Induced Wafer Warpage Optimization for Multi-chip
Practical Dummy Components Daisy Chain Dummy Components
Typical Packaging Architecture for a High Performance Flip Chip
Practical Components
Stresses Experienced in Flip Chip BGA Packages.
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