UBM (under bump metallurgy) structure

Test Structures for (a) Direct Bump with metal interconnect only and

Kyung-Wook PAIK Korea Advanced Institute of Science and

Figure 1 from Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

UBM (under bump metallurgy) structure

Figure 8 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Interconnection in IC Assembly - ppt video online download

Pb-Free Solders for Flip-Chip Interconnections

Materials, Free Full-Text

PDF) The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

Scaling Bump Pitches In Advanced Packaging

Electroless UBM and solder bump [12, 17]