Modeling study of thermosonic flip chip bonding process - ScienceDirect
Schematic of laser doppler vibrometer measure system.
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates - ScienceDirect
PDF] Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates - ScienceDirect
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Electronics, Free Full-Text
Fastener + Fixing Magazine #131
Table I from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
